mxm Graphics Module
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To enable OEMs & system builders to ship graphics options with
fastest time-to-market, and with minimal system qualification
What is MXM?

MXM is a standard interface defined between PC systems and graphics subsystems. MXM covers the mechanical, electrical, thermal, and software interface, including the connector.

System Benefits

  • Fastest time-to-market for graphics
  • Reduced in-system qualification
  • Single system cooler design across multiple modules
  • One graphics module leveraged across many platforms
  • More graphics options for each system

Documents And Specifications

 » 3/6/2012

MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1 Revision 1.0

 » 7/20/2009

MXM Graphics Module Software Specification Version 3.0 Revision 1.1

 » 6/22/2009

MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.0 Revision 1.1

 » 6/22/2009

MXM 3.0 Revision 1.1 Type A Module 3D Model

 » 6/22/2009

MXM 3.0 Revision 1.1 Type B Module 3D Model

Schedules

 » March 2012

Official release of MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1 Revision 1.0

 » July 2009

Official release of MXM Graphics Module Software Specification Version 3.0 Revision 1.1

 » June 2009

Official release of MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.0 Revision 1.1

What's New
» 3/6/2012 MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.1 Revision 1.0
» 7/20/2009 MXM Graphics Module Software Specification Version 3.0 Revision 1.1
» 6/22/2009 MXM Graphics Module Mobile PCI Express Module Electromechanical Specification Version 3.0 Revision 1.1
» 
» 6/22/2009 MXM 3.0 Revision 1.1 Type A Module 3D Model
» 6/22/2009 MXM 3.0 Revision 1.1 Type B Module 3D Model
» 6/22/2009 MXM 3.0 Revision 1.1 Type A System Mechanical Compliance 3D Model
» 6/22/2009 MXM 3.0 Revision 1.1 Type B System Mechanical Compliance 3D Model
» 6/22/2009 MXM Version 3.0 Mechanical Design Guide Revision 1.1
» 6/22/2009 MXM Version 3.0 Heat Sink Tolerance Application Note Revision 1.1
ADOPTERS
Acer Aces AMCO TEC INTERNATIONAL INC. AMD American Megatrends Asus Auras AVC BizLink Technology Clevo
Compal Cooler Master Dell DRAGONSTATE TECHNOLOGY CO.,LTD. ECS ELITEGROUP FIC Forcecon Technology Foxconn Insyde Software Corp Inventec
JAE Lotes Mitac MSI NVIDIA OCZ Pegatron Phoenix Technologies SAMSUNG Shuttle
Simula Technology Inc. Speedtech Vestel Wistron YUAN  
PARTNERS
Alpha Omega Semiconductor Cooper Bussmann Cyntec DongGuan Meadville Group (DMC) Dynamic Details Elec & Eltek Printed Circuit Board Corp. Fairchild Semiconductor Kemet Mag Layers USA muRata
NEC / TOKIN ON Semiconductor Panasonic Renesas Sanyo SuperWorld / Tai-Tech TDK Topsearch Printed Circuits Ltd. Tripod Viasystems
Vishay Wurth  
Use of the term "partner" here is not intended to imply any legal relationship between the parties. Each company is an independent entity and nothing in this website or related marketing material is intended to create a joint venture, partnership, franchise, employment or agency relationship or fiduciary duty of any kind.

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